Injini yokucindezela inzwa 2cpp3-68 1946725 yeCarter Excaterator

Indlela yokulungiselela inzwa yokucindezela, ibonakala ngokuhlanganisa lezi zinyathelo ezilandelayo:

S1, ukuhlinzeka nge-wafer ngenhla emuva nendawo yangaphambili; Kwakha umucu we-piezoresoresive kanye nendawo yokuxhumana engaphezulu yendawo engaphambili ye-wafer; Kwakha umgexo ojulile wokucindezela ngokufaka indawo engemuva ye-wafer;

I-S2, ihlanganisa ishidi lokusekelwa ngemuva komhlane;

I-S3, ekhiqiza izimbobo ezihola phambili kanye nezintambo zensimbi ohlangothini lwangaphambilini lwe-wafer, kanye nokuxhuma imichilo ye-piezoresorive ukwakha ibhuloho le-wheatstone;

I-S4, Ukubeka kanye nokwakha ungqimba we-pasivation engaphezulu komhlaba we-wafer, kanye nokuvula ingxenye yesendlalelo sokuhamba ukuze wakhe indawo ye-metal pad. 2. Indlela yokwenza inzwa yokucindezela ngokuya ngesimangalo 1, lapho i-S1 inezinyathelo ezilandelayo: S11: ukuhlinzeka ngobukhulu ngefilimu ebucayi ebusweni bengcindezi obuseceleni; I-S12: Ukufakwa kwe-Ion kusetshenziswa endaweni yangaphambili ye-wafer, imichilo ye-piezoresurive yenziwa ngenqubo yokushisa okushisa okuphezulu, kanye nezifunda zokuxhumana zidonswa kakhulu; I-S13: Ukubeka kabusha kanye nokwakha ungqimba oluvikelayo ebusweni obungaphambili; I-S14: Etching nokwakha umgodi ojulile wokucindezela ngemuva kwe-wafer ukwakha ifilimu ebucayi. 3. Indlela yokukhiqiza yenzwa yokucindezela ngokuya ngesimangalo 1, lapho i-wafer i-SOI.

Ngo-1962, uTufte et al. Kwenziwe inzwa yengcindezi ye-piezoresoresistive nge-Silicon Piezoresuristove strips kanye nokwakheka kwefilimu ye-silicoon okokuqala, futhi kwaqala ucwaningo nge-Piezoresistive Pressure Sensor. Ngasekupheleni kwawo-1960s nasekuqaleni kwawo-1970, okuvela ubuchwepheshe obuthathu, okungukuthi, ubuchwepheshe be-silicon asotropic etchinging, ubuchwepheshe be-anodic bonding nobuchwepheshe be-anodic bonding, wadlala indima ebalulekile ekwenzeni ngcono ukusebenza kwenzwa yengculazi. Kusukela ngo-1980s, ngokuthuthuka okwengeziwe kobuchwepheshe be-micromachinsing, njenge-anisotropic etching, i-lithotyropic etching, i-lithoty doping, ukuhlanganiswa kwenzwa, ukuzwela kwengcindezi kuncishisiwe, futhi ukuzwela kuthuthukile, futhi okuphumayo kuphakeme futhi ukusebenza kuhle kakhulu. Ngasikhathi sinye, ukuthuthukiswa kanye nokusetshenziswa kobuchwepheshe obusha bakwa-micromachinsing technowk kwenza ukuqina kwefilimu kwengcindezi yengcindezelo kulawulwa ngokunembile.